Tipi:

  • Dual Layer,
  • Multilayer a 12 strati,
  • Materiali Dissimili,

Tecnologie:

  • E.N.I.G.
  • Doratura Aree e cavit√†,
  • Doratura chimica,
  • Doratura elettrolitica,
  • Rohs compliant,
  • Blind and Buried vias,
  • Buried discrete components,
  • Solder Resist,
  • Silkscreen,